Power chips are linked to external circuits with product packaging, and their performance depends on the support of the packaging. In high-power circumstances, power chips are generally packaged as power components. Chip interconnection describes the electrical link on the upper surface area of the chip, which is typically aluminum bonding cord in traditional modules. ^
Conventional power module plan cross-section
Presently, business silicon carbide power modules still mainly use the packaging modern technology of this wire-bonded standard silicon IGBT component. They face issues such as big high-frequency parasitical specifications, insufficient warmth dissipation ability, low-temperature resistance, and not enough insulation stamina, which limit making use of silicon carbide semiconductors. The screen of superb efficiency. In order to fix these problems and completely make use of the substantial prospective advantages of silicon carbide chips, lots of new packaging technologies and remedies for silicon carbide power components have actually arised over the last few years.
Silicon carbide power module bonding approach
(Figure (a) Wire bonding and (b) Cu Clip power module structure diagram (left) copper wire and (right) copper strip connection process)
Bonding materials have actually developed from gold cable bonding in 2001 to aluminum cord (tape) bonding in 2006, copper cable bonding in 2011, and Cu Clip bonding in 2016. Low-power tools have established from gold cables to copper cords, and the driving pressure is cost reduction; high-power tools have actually established from light weight aluminum wires (strips) to Cu Clips, and the driving force is to improve product efficiency. The better the power, the greater the needs.
Cu Clip is copper strip, copper sheet. Clip Bond, or strip bonding, is a packaging procedure that uses a strong copper bridge soldered to solder to connect chips and pins. Compared with conventional bonding product packaging approaches, Cu Clip modern technology has the following benefits:
1. The link between the chip and the pins is made of copper sheets, which, to a certain degree, replaces the typical wire bonding method in between the chip and the pins. Consequently, an one-of-a-kind plan resistance value, greater existing flow, and better thermal conductivity can be obtained.
2. The lead pin welding area does not need to be silver-plated, which can fully save the expense of silver plating and bad silver plating.
3. The item appearance is totally consistent with regular products and is primarily used in web servers, portable computers, batteries/drives, graphics cards, electric motors, power products, and other areas.
Cu Clip has 2 bonding methods.
All copper sheet bonding technique
Both the Gate pad and the Source pad are clip-based. This bonding technique is much more pricey and complicated, but it can attain much better Rdson and much better thermal effects.
( copper strip)
Copper sheet plus cable bonding approach
The source pad uses a Clip method, and the Gate utilizes a Cable technique. This bonding technique is slightly cheaper than the all-copper bonding method, saving wafer area (applicable to really small gateway areas). The procedure is easier than the all-copper bonding method and can obtain better Rdson and far better thermal effect.
Provider of Copper Strip
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